MediaTek launched a new mid-range 5G smartphone chipset in China, Mediatek Dimensity 900 5G. It comes as the company’s latest 5G mobile SoC. Moreover, it is based on a 6nm architecture like the Dimensity 1100 and Dimensity 1200. The new SoC is a quad-core chip with third-generation MediaTek APU AI. Additionally, there are rumors that it will power the upcoming Reno6 in China.
Furthermore, it is a successor to the MediaTek Dimensity 820 SoC that is based on 7nm architecture. The new MediaTek Dimensity 900 5G brings quite a few improvements over the older chip. ItSs’ designed for mid-range smartphones but it is unclear which smartphone will be the first to bear the new SoC.
MediaTek Dimensity 900 5G Features
This latest 5G processor is built on TSMC’s 6nm fabrication. It is an octa-core processor with two performance cores and six efficiency cores. Moreover, the two A78 cores are clocked at 2.4GHz. It also has six A55 efficiency cores clocked at 2.0GHz. The SoC supports flagship LPDDR5 memory and UFS 3.1 storage. n terms of 5G connectivity, it can allow dual 5G SIM cards and download speeds up to 2.7Gbps. It also supports the latest VoNR services.
Furthermore, MediaTek Dimensity 900 5G chipset also integrates an ARM Mali-G68 MC4 GPU. It comes along with an independent artificial intelligence (AI) processing unit that delivers optimal power efficiency for extended battery life. It also comes with MediaTek’s HyperEngine gaming engine. In addition, it also comes with support for Wi-Fi 6, Bluetooth 5.2 connectivity, and dual-band 5G.
Smartphones running on the MediaTek Dimensity 900 5G can support a Full HD+ 120Hz display and a 108MP primary camera. It comes with a MiraVision HDR Video technology that adjusts a wide range of video stream factors, including color, brightness, contrast, sharpness, and dynamic range. On the other hand, they have also confirmed that the chipset will launch in smartphones launched in Q1 2021.
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